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Intel

So here’s the new Intel 11th Gen CPUs and it will be available from this fall.

by Amal Varghese September 3, 2020

written by Amal Varghese

Intel has officially announced its new Intel 11th gen CPUs, stating it to be the worlds Best Processors that could run on light and thin laptops. The news takes on that the new 11th Gen Tiger Lake processors for laptops will feature the company’s new integrated Xe graphics, Thunderbolt 4 support, Wi-Fi 6, and a big leap in performance and battery life which is significantly better than the previous Ice Lake chips.

With this launch, Intel plans to put forth its new nine 11th Gen designs, for both its U (referred as UP3) and Y series (referred as UP4) which would be ultimately led by the Core i7-1185G7, which offer base speed of 3.0GHz with a massive single core turbo boost of 4.8GHz. With which the device can attain upto 4.3Ghz on all core boost. Almost all the processors feature a very capable integrated version of Intel’s Iris Xe graphics, at a maximum speed of 1.35GHz graphic speed.

Configuration of the Intel 11th gen CPUs

Model	Cores/ Threads	Graphics	Graphics (EUs)	Watts	Base Frequency (GHz)	Single Core Turbo (GHz)	All Core Turbo (GHz)	Cache
Core i7-1185G7	4C/8T	Intel Iris Xe	96	12-28W	3.0	4.8	4.3	12MB
Core i7-1165G7	4C/8T	Intel Iris Xe	96	12-28W	2.8	4.7	4.1	12MB
Core i5-1135G7	4C/8T	Intel Iris Xe	80	12-28W	2.4	4.2	3.8	8MB
Core i3-1125G4	4C/8T	Intel UHD Graphics	48	12-28W	2.0	3.7	3.3	8MB
Core i3-1115G4	2C/4T	Intel UHD Graphics	48	12-28W	3.0	4.1	4.1	8MB
Core i7-1160G7	4C/8T	Intel Iris Xe	96	7-15W	1.2	4.4	3.6	12MB
Core i5-1130G7	4C/8T	Intel Iris Xe	80	7-15W	1.1	4.0	3.4	8MB
Core i3-1120G4	4C/8T	Intel UHD Graphics	48	7-15W	1.1	3.5	3.0	8MB
Core i3-1110G4	2C/4T	Intel UHD Graphics	48	7-15W	1.8	3.9	3,9	6MB

On its Architecture Day 2020, the company had already made a preview of the new chipsets, the new Intel 11th Gen CPUs had proved to be maintaining its challenging features. Besides all these factor the device is still developed on a 10 nanometer node, which is similar to its previous gen Ice Lake models. But the chipset upgrades tp the Willow Care architecture titled as 10nm SuperFin design which according to intel has maintained a power efficiency feature which intel has not been keeping up since some time. With an increased power efficiency the device might also offer better speed.

Apparently Intel was under the impression of poor defensive performance in the past years with lack of complete competitors. With the launch of these new CPUs Intel is aiming for something big. The Intel 11th gen CPUs have strikingly updated its competition with AMD. AMD has already picked up this rivalry to another level by introducing the Ryzen 4000 chipset which has a 7nm node and is significantly ahead of the pre-gen and the new-gen Intel CPUs, at many cases these chipsets have outperfomed Intel’s laptops. As if this rivalry was insignificant, other major laptop manufacturers like Microsoft and Apple began to shake hands with ARM chipsets which are far superior to any current CPUs.

Intel also vouches on its new Integrated Xe graphics, which according to the company will offer a considerable advance in its graphic department. Intel claims that it could potentially offer a huge benefit than just numbers. At the demonstration of this this new chipset, it had a competition with the Nvidia MX350 GPUs.

Along with with the support for 8K HDR displays are also a significant upgradation for the chipset, it also powers four 4K HDR displays at once. An improvement to the built in AI engine could benefit camera quality.

Along with the Intel 11th gen CPUs, the company is planning to start a new certification standard called Intel Evo. Evo is said to consist of a higher requirement stats which would guarantee that your laptop will run over nine hours of real world usage in a single charge along with fast charging, Thunderbolt 4, WiFi 6 and system wake in less than a second. A system with an Evo logo would guarantee a high quality machine and more than 20 Evo verified machine should be available this year. The Intel 11th gen CPUs will be packed in various upcoming laptops.

September 3, 2020 0 comment

Intel Processor

Intel Lakefield processor is brought to challenge ARM

by Amal Varghese June 11, 2020

written by Amal Varghese

Details of the new Intel Lakefield processors are out

After their failure with Atom SoC that was launched with the ASUS ZenFone 2, Intel had dropped plans to produce SoCs. This was mainly because of their technology being inferior to the smartphone SoC giants like Snapdragon or Apple Bionic series. However, the company has carried out its pursuits in low voltage chips designed to power 2-in-1 devices, laptops, foldable devices, etc, while completely keeping away from smartphone industry. But, Intel’s Core M, later came to be known as the Core Y series, which is still being used in laptops such as the Apple MacBook Air.

Now, Intel has disclosed more details about its upcoming “Lakefield” chip, which is not an Atom chip nor a pure Core based chip (although they will be branded as part of the “Intel Core” lineup). They can be viewed as the successor of the Core M/Core Y-series philosophy, and are designed to harden Intel’s leadership position against ARM in the ultra-mobile device space.

Focus of Intel Lakefield Processor

Intel Lakefield Processor is its first chips to merge its Core i3 and i5 hardware together with low-power “Tremont” Atom cores. Officially, they’re called “Intel Core processors with hybrid technology.” The company is positioning Lakefield as the ideal hardware for incredibly thin laptops and foldable.

It is of no doubt that the 10 nanometer based core i3 and i5 hardware will handle ponderous workloads, while this less challenging tasks move over to the Atom cores, similar to the arrangement Qualcomm uses. And unlike the Snapdragon 8cx laptop chipset, which is limited to ARM compatible apps, Lakefield processors will also run all 32-bit and 64-bit Windows software.

Intel is able to combine multiple chip architectures and onboard memory onto a single processor thanks to its Foveros 3D packaging technology. That allows the company to stack multiple logic and memory dies on top of each other, instead of spreading them out on a flat 2D plane like traditional processors. The basic takeaway is that Intel Lakefield processors also won’t need to take up much physical space, making them ideal for very thin devices.

There will be two Intel Lakefield processors available at first in the form of the Core i5-L16G7 and the Core i3-L13G4. The differences between the two can be seen in the table below.

Processor Number	Graphics	Cores / Threads	Graphics (EUs)	Cache	TDP	Base Freq (GHz)	Max Single Core Turbo (GHz)	Max All Core Turbo (GHz)	Graphics Max Freq (GHz)	Memory
i5-L16G7	Intel UHD Graphics	5/5	64	4MB	7W	1.4	3.0	1.8	Up to 0.5	LPDDR4X-4267
i3-L13G4	Intel UHD Graphics	5/5	48	4MB	7W	0.8	2.8	1.3	Up to 0.5	LPDDR4X-4267

The i5 Intel Lakefield Processor has more graphics Execution Units (EUs): 64 vs. 48. The grahics maximum frequency is capped at up to 0.5GHz which is comparatively much less than Amber Lake’s 1.05GHz, which again proposes that Intel is taking a broad but measured way to enhance their performance while keeping power requirements in check at the same time. Both of them have the same TDP at 7W. The base frequency of i5 is 1.4GHz, while the i3 has barely of 0.8GHz base frequency.

The max single core turbo frequency (applicable only for the Sunny Cove core) is 3.0GHz and 2.8GHz for the i5 and the i3 respectively, while the max all core turbo frequency is 1.8GHz and 1.3GHz respectively. Presumably, Intel Lakefield Processor is relying on Sunny Cove’s increased IPC over Skylake to offset these low clock speeds. Keep in mind there is only one “big” core (in comparative) terms, so don’t expect these ultra-mobile chips to compete with regular U series chips found in the Ice Lake, Comet Lake, and Tiger Lake platforms. The memory support is LPDDR4X-4267, which is incidentally higher than Ice Lake.

Gregory Bryant, Intel senior vice president in the Client Computing Group, displays a “Lakefield” reference board during Intel Corporation’s news event at CES 2019 on Jan. 7, 2019, in Las Vegas. Lakefield features a hybrid CPU architecture with Intel’s Foveros 3D packaging technology. Intel displays how its technology is the foundation for the world’s most important innovations and advances at CES 2019 from Jan. 8-11 in Las Vegas. (Credit: Walden Kirsch/Intel Corporation)

AnandTech was able to provide more detail on the Intel Lakefield Processor. Supposedly, Intel told the publication that the Intel Lakefield Processor will use the Tremont cores for almost everything, and only call on the Sunny Cove core for user-experience type of interactions, such as typing or interacting with the screen.

Overall, the Lakefield platform seems to be very promising. The biggest flaw of Intel’s low-power chips has been that up until now, they have been priced too expensive. It doesn’t seem that this will be changing with Lakefield, but at least consumers will get to expect new types of PCs such as the aforementioned first three devices powered by Lakefield. At least for now, Intel remains dominant in PC because of the overwhelming advantage of app support, and announcements such as Lakefield mean that ARM and Qualcomm will need to keep iterating to overcome Intel’s intrinsic instruction set advantage.

June 11, 2020 0 comment

Computer CPU Intel

Intel’s 10th Generation Comet Lake Desktop Processors finally Unveiled

by Robin Sunny May 3, 2020

written by Robin Sunny

With the warps finally off Intel’s brand spanking new 10th Gen desktop CPU, and with the 10th Gen rolled out on all of its laptop lineup. The company announced its latest ‘Comet Lake’ processors across its i9, i7, i5 and i3 lineups, while these new parts are still based on the 14nm ‘Skylake’ process from a few years ago but tweaked within an inch of its life.

Intel announced 32 of its new 10th gen models from i9-10900K at the top all the way to the Celeron chips at the bottom. Having said that most chips are just a slight variation of each other with standard models having K, KF or T variations (K-Unlocked; F-Without a iGPU; KF-Unlocked and Without a iGPU; T-Low power variant).

Although, having a older process from 2015 might not be such a bad thing, as Intel has continued to work to refine earlier process and improve its clock speeds and increase the core and thread count.

With Intel’s razor-sharp focus on unqualified and raw clock speed, we see core clock speed of more than 5GHz on a Single core and up to 4.9GHz on all core clock speeds. To Intel’s credit we do have generation to generation performance deltas, but this is still without solid performance data and Intel is also still very keen on comparisons to a ‘three year old PC’. Presumably, they’re hoping that people who aren’t up-to-date on the whole Intel vs AMD rivalry would just think, “yes, that sounds nice, let’s go ahead and upgrade this year.”

The new chips reach these faster speeds thanks to new technologies offered on the high-end chips like the 10900K, including its Turbo Boost 3.0 technology and the ‘Thermal Velocity Boost’ that will increase clock speed when the processor is at a temperature of 70° Celsius or lower, assuming there’s power available.

The new chips also support up to DDR4-2933MHz RAM, support for 2.5 Gigabit Ethernet, and like the rest of the 10th Gen lineup, they also feature integrated Wi-Fi 6 by default. The downside to those upgrades are that Intel is physically changing its socket configuration for these new chips, something to keep in mind if you’re looking to upgrade. Most of the Core lineup also featured Intel’s integrated UHD Graphics 630.

May 3, 2020 0 comment